PCI 9054 BGA Packaging
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Plastic BGA 225pin
| Symbol | Term | Dimensions in Millimeters | Definition | ||
|---|---|---|---|---|---|
| Min. | Nom. | Max. | |||
| øb | 0.6 | 0.76 | 0.90 | ||
| A | Mounting height | 2.13 | Height from the ground plane to the top of the package | ||
| A1 | Standoff height | 0.5 | 0.6 | 0.7 | Height from the ground plane to the bottom edge of the package (PGA) |
| A2 | Package height | 1.48 | 1.53 | 1.58 | Height of the package itself (excluding warp of package) |
| Theta2 | 30° | ||||
| C1 | Chamfering | 1.0 | Chamfer of PCB corner (BGA only) | ||
| C2 | Chamfering | 4.0 | Chamfer of the mold (BGA only) | ||
| e | Linear lead pitch | 1.5 | Theoretical lead pitch | ||
| D1 | Package length | 23.5 | 24 | 24.7 | Length of package (excluding burr) |
| E1 | Package width | 23.5 | 24 | 24.7 | Width of the mold (BGA only) |
| D | Package length | 27 | Package length | ||
| E | Package width | 27 | Width of package | ||