Packaging

Packaging

Packaging Outlines
Packaging Flow Show Chart

Soldering

Recommended Solder Profiles Infrared (IR) Reflow PQFP Show Chart
Infrared (IR) Reflow (PBGA) Show Chart
Vapor Phase Reflow Show Chart
Visual Inspection / Soldered Leads View inspection hints

Leadframe Material / Lead Finish

Product Package Configuration Leadframe Material Lead Finish
PCI 9030 PQFP 176 Alloy42 Sn/Pb-85/15 Plate
PCI 9030 µBGA 180 BT Solder Ball
PCI 9054 PBGA 225 BT Solder Ball
PCI 9054 PQFP 160 Alloy42 Sn/Pb 85/15 Plate*
PCI 9054 PQFP 176 Alloy42 Sn/Pb 80/20 Plate
PCI 9052 PQFP 160 Copper Sn/Pb 85/15 Plate*
PCI 9060
(series)
PQFP 208 Alloy42 Sn/Pb 85/15 Plate
PCI 9080 PQFP 208 Copper Sn/Pb 85/15 Plate

*Sn / Pb: %Tin / %Lead

PLX Lead Free Device Information

Product Peak Temperature Reflow Profile Reliability Report Material Analysis Data
PCI 9030-AA60PI F 260° C Download Download Download
PCI 9030-AA60BI F 260° C Download Download Download
PCI 9052 G 260° C Download Download Download
PCI 9054-AC50BI F 260° C Download Download Download
PCI 9054-AC50PI F 260° C Download Download Download
PCI 9056-BA66BI G 260° C Download Download Download
PCI 9656-BA66BI G 260° C Download Download Download